this post was submitted on 27 Feb 2026
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Traditional Art

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This is a community dedicated to showcasing all types of traditional medium art.

Traditional means a physical medium. This includes acrylic, pastel, encaustic, gouache, oil and watercolor paintings; Ink illustrations; Pencil and charcoal sketches; Etchings; Lithographs; Wood prints; pottery; ceramics; metal, Wire and paper sculptures; Tapestry; Weaving; Quilting; Wood carvings, Armor Crafting and more.

It EXCLUDES digital art: anything made with Photoshop, Clip Studio Paint, Krita, Blender, GIMP or other art programs, or AI art.


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1- Do not post Digital or AI art.

2- NSFW content is allowed but it must be tagged.

3 - Extreme NSFW content like gore, graphic imagery, fetishistic works and straight up porn is not allowed.

3- Post only images. No gifs, videos or articles.

4 - The post title should contain the title of the artwork or the name of the artist or ideally both if available. If there is further information about the artwork you want to convey, do it in the body of the post or in the comments.

5 - You can post your own art but keep in mind not to spam. An [OC] tag in the title of your post is recommended.

6 - Avoid extraneous objects and post only the art.

7 - Be civil to other community members.

8 - Keep on the topic of art in the comments. Extreme tangents or arguments will be removed.

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[–] Rocketpoweredgorilla@lemmy.ca 37 points 1 day ago* (last edited 1 day ago) (2 children)
[–] setsneedtofeed@lemmy.world 23 points 1 day ago

Almost certainly the reference image.

[–] protist@mander.xyz 10 points 22 hours ago (2 children)

Wasn't it a problem with the heat sink disconnecting from the processor? If I'm recalling correctly you could fix this by reaffixing it with thermal paste

[–] jsheradin@fedia.io 1 points 4 hours ago

There's a ton of old rumors and "fixes" but it was recently confirmed by Microsoft that the main issue was failure of the flip chip interposer connections caused by incorrectly engineered underfill epoxy on early batches of GPUs. This is the same issue behind Nvidia's Bumpgate and likely the PS3 YLODs.

BGA solder balls, x-clamps, thermal paste, overheating, etc were never actually a real issue. Heat gunning/towel tricking the console just warped chips enough that they temporarily made contact and would work for a little while. Only permanent fix is to replace the GPU with one made after they changed underfill epoxies.

Now that these consoles are 20+ years old there's also aging caps and whatnot to worry about too.

[–] Rocketpoweredgorilla@lemmy.ca 19 points 22 hours ago* (last edited 22 hours ago) (1 children)

Ya they'd overheat and warp, breaking the connection and causing the "ring of death". I bought a few from garage sales in the past, fixed them with a heatgun, and gave them to family and friends.

I find the best idea is just to put an extra fan on them to stop them from getting too hot in the first place. My original 360 still works fine to this day because it never gets the chance to heat up with the extra fan running.

[–] vaionko@sopuli.xyz 8 points 17 hours ago (1 children)

Yeah the cooling on those was bad. The towel trick (I used a stick in the fan) would make it overheat even more, reflowing the solder joints and fixing it

[–] Rocketpoweredgorilla@lemmy.ca 1 points 12 hours ago (2 children)

It would not surprise me at all if that 'flaw' was by design to sell more units.

[–] ProdigalFrog@slrpnk.net 5 points 12 hours ago (1 children)

The red ring was an extremely costly recall and repair for Microsoft ($1.1 billion) on a console they already sold at a loss to recoup with game sales. It also hurt the brand image, giving the competition a leg up.

In this case the design flaw was from them trying to skimp as much as possible on the cooling solution to reduce how much loss each console sale would bring.

[–] Rocketpoweredgorilla@lemmy.ca 1 points 11 hours ago (1 children)

Huh TIL. Strange that they didn't fix the issue with the 360 slims, because they got pretty hot quick too. I guess maybe they didn't realize how bad it was until later.

[–] ProdigalFrog@slrpnk.net 2 points 6 hours ago

Apparently the S model was more resilient to the solder joints breaking, but still had a somewhat inadequate cooling solution.

[–] balsoft@lemmy.ml 1 points 11 hours ago

To add to another comment: they failed way too early for that. If you're doing planned obsolescence, you must make sure it fails soon after the warranty period ends, not within weeks or months after the purchase.