this post was submitted on 28 Sep 2026
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A20 Pro vs Intel Ultra 7 Series 3

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[–] GamingChairModel@lemmy.world 3 points 1 day ago

Technically these are all System in Package (SiP) rather than systems on a chip (SoCs). It's not cost effective to waste silicon area on things like memory and storage in the latest and greatest TSMC nodes, so they have several different silicon dies that they connect together using advanced packaging techniques, but where each silicon die in that package might come from a different foundry/process.