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submitted 5 months ago by limerod@reddthat.com to c/samsung
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[-] limerod@reddthat.com 3 points 5 months ago

TL;DR

  • Samsung is reportedly working on a new cooling solution for future Exynos smartphone processors.
  • This packaging tech is apparently derived from PCs and servers and sees a type of heatsink attached to the top of the processor.
  • Work on the tech could be completed by Q4 2024, suggesting the Exynos 2500 could potentially use it.
this post was submitted on 04 Jul 2024
7 points (100.0% liked)

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