this post was submitted on 20 Apr 2026
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TSMC schedules 1.4nm mass production for 2028, targets sub-1nm pilots in 2029 (biz.chosun.com)
submitted 4 weeks ago* (last edited 4 weeks ago) by Rekall_Incorporated@piefed.social to c/hardware@lemmy.world
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Taiwan's TSMC, the world's largest foundry (contract semiconductor manufacturer), plans to begin mass production of 1.4-nanometer (nanometer, one-billionth of a meter) process semiconductors in 2028, Taiwanese media including the China Times reported on the 20th.

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[–] ArrowMax@feddit.org 5 points 4 weeks ago

Reminder that the "nm"-node names do not correlate to any physical feature size directly and have been mostly marketing terms for the last ~20 years. Nowadays, "1.4nm" just means vaguely better than the "2nm" process.

On the "3nm"-node, wikipedia

The term "3 nanometer" has no direct relation to any actual physical feature (such as gate length, metal pitch, or gate pitch) of the transistors. According to the projections contained in the 2021 update of the International Roadmap for Devices and Systems published by IEEE Standards Association Industry Connection, a "3 nm" node is expected to have a contacted gate pitch of 48 nanometers, and a tightest metal pitch of 24 nanometers.

Still impressive, of course, but quite misleading.